SOLUTIONS
With its CLEAN & GREEN Technology, we provide a broad line of technologically advanced, yet user-friendly Environmental Pollution Control products for industrial emissions and other facilities-process solutions that help to improve productivity while protecting both human and environment.
Exhaust Management Solutions
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Process Effluent Treatment Systems (POU Abatements)
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Toxic Vent purge & Rupture Release Abatement systems
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Emergency Release Scrubbers and systems
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Air pollutions control- VOCs, Ozone, NOx, Sox, Odor, Plum scrubber systems
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Fore line / Exhaust Traps for Etch & CVD/DIFF applications
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Others: Fittings, Valves, Gaskets, Heating Jackets, Bellows, performance parts, etc.
Equipment Life-Cycle-Support (LCS)
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POU Scrubber reconditioning support
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Maintenance, Repair, Modification & Performance Upgrades
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Consumable supply and competent second source parts
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Dry scrubber module refill maintenances & replenishment program
M&E: General Facilities Installations & Engineering works
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Control panels, PLC automation & Instrumentation solutions
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Plant equipment maintenance & Repairs
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Other M&E system Integration and installation support
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Ventilation, Piping / Plumbing, Electrical cabling, etc.
PoU Waste Gas Treatment Solutions
POU control systems are designed for treating air emissions from the outlet of the semiconductor process to remove the compounds of interest before entering the main exhaust ductwork. Historically, POU control systems have been installed for reducing production downtime and for health and safety reasons. Recently, air emissions reduction has been another reason for using POU control systems. Typically, POU control systems are interlocked with the process equipment (i.e., when the POU control system fails, the process equipment is shut down). The main reasons for the use of POU control systems are as follows:
1. Exhaust restrictions (blocked ductwork): reactions between gases, solids from the process, or condensation of vapors produce solid build-up in ductwork. This build-up can cause production downtime to clean ductwork, ductwork collapsing, etc. An additional issue is the handling and disposal of these solids during and after removal.
2. Ductwork fires/explosions: flammable (hydrogen, etc.) and pyrophoric (silane, etc.) gases are used in semiconductor equipment. These gases can cause a fire and/or explosion in the ductwork, possibly resulting in major facility damage and personnel injury.
3. Duct corrosion: etching gases (chlorine, etc.) and byproducts (i.e., hydrogen chloride from boron trichloride) can corrode metal ductwork and other materials of construction. This results in production downtime and possible personnel exposure to these gases in the area outside of ductwork.
4. Exposure to personnel: toxic gases (hydrides, chlorine, etc.) are controlled near the semiconductor equipment outlet to reduce the likelihood that any toxic gases can migrate into the area outside ductwork where personnel are located.
5. Ammonium compounds formation: ammonia will react with acid compounds (hydrogen chloride, nitric acid, etc.) to form ammonium compounds (ammonium chloride, ammonium nitrate, etc.). These ammonium compounds will aggregate in the ductwork (see #1 previously) and possibly generate a sub-micron particle visible opacity at the stack outlet (generally at 1 ppmv or greater at stack outlet).
6. Air regulatory requirements: emissions limits may need to be met in specific regulatory jurisdictions that require POU control systems to be used. Some of this need is due to the lower removal efficiencies for compounds of interest at the centralized (“end-of-pipe”) scrubbers (e.g., chlorine).
